Polymax® ED-P4 is commonly used in the stabilization of electroless copper plating baths. Recommended used levels are 0.25 - 1.0% in the bath.
Polymax® ED-P4 belongs to a line of products developed for plating applications. The Polymax® materials offer a variety of functions in both electroless and electrolytic plating baths. Low treat rates and a diversity of chemistries offer economic and formulation options in numerous types of baths.
Product advantages:
Applications:
Markets and applications
Metallurgical industry
Function
Metal plating agents
Composition
Polyether polyols
Segment
Specialty Products
Surfactants