Polymax® ED-P4 is commonly used in the stabilization of electroless copper plating baths. Recommended used levels are 0.25 - 1.0% in the bath.
Polymax® ED-P4 belongs to a line of products developed for plating applications. The Polymax® materials offer a variety of functions in both electroless and electrolytic plating baths. Low treat rates and a diversity of chemistries offer economic and formulation options in numerous types of baths.
Polymax® ED-P4 is commonly used in the stabilization of electoless copper plating baths at a recommended use level of 0.25-1.0% by weight. At these concentrations, the product provides a fine grain with excellent deposit properties. Polymax® ED-P4 has extremely high activity and purity and can be used in high build systems (≥ 2ϻm/20 min) which is a preferred method for the electronics industry.
Polymax® ED-P4 is a propoxylated ethylene diamine that is uniquely suited for these electroless copper plating systems. It is non-viscous and has a high flash point to minimize storage and handling issues. It functions as a chelator and stabilizer while offering a low foaming profile to the batch to allow for faster plating speeds and increased efficiency.